Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/32605
Title: Method for low temperature lamination of metals to fluoropolymers
Authors: KANG, EN TANG 
SHI, JIAN-LI 
NEOH, KOON GEE 
TAN, KUANG LEE 
CUI, CHENG QIANG 
LIM, THIAM BENG 
Issue Date: 1-Jan-2002
Source: KANG, EN TANG,SHI, JIAN-LI,NEOH, KOON GEE,TAN, KUANG LEE,CUI, CHENG QIANG,LIM, THIAM BENG (2002-01-01). Method for low temperature lamination of metals to fluoropolymers. ScholarBank@NUS Repository.
Abstract: The present invention is directed to a method for the lamination of metals, and especially copper, to the surfaces of fluoropolymers at temperatures substantially below the sintering temperatures or melting temperatures of the fluoropolymers. More specifically, the invention is directed to a method for surface modification of fluoropolymers by thermal graft copolymerization with concurrent lamination of a metal (e.g. copper) in the presence of a functional monomer. The process can be carried out under atmospheric conditions and in the complete absence of an added polymerization initiator. The so-laminated fluoropolymer-metal interfaces exhibit T-peel strengths of no less than 8 N/cm and delaminate via cohesive failure inside the fluoropolymer.
URI: http://scholarbank.nus.edu.sg/handle/10635/32605
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
File Description SizeFormatAccess SettingsVersion 
US6334926.PDF52.46 kBAdobe PDF

OPEN

PublishedView/Download

Page view(s)

157
checked on Dec 15, 2017

Download(s)

100
checked on Dec 15, 2017

Google ScholarTM

Check


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.