Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/16977
Title: Characterization and testing of nanofluid cooling technology for electronic systems
Authors: XUE ZHENGJUN
Keywords: Nanofluid, Thermal Conductivity, Microchannel Heat Sink, Thermal Contact Resistance, Electronics Cooling
Issue Date: 28-May-2005
Source: XUE ZHENGJUN (2005-05-28). Characterization and testing of nanofluid cooling technology for electronic systems. ScholarBank@NUS Repository.
Abstract: A Nanofluid is an innovative type of highly efficient heat transfer fluid, which was made by dispersing nanometer-sized metallic or non-metallic particles in various base fluids. With their superior thermal properties, nanofluids are expected to be a promising coolant candidate for thermal management systems of next generation high heat dissipation electronic systems.In this research, one apparatus for thermal conductivity measurement using the steady-state parallel-plate method was fabricated. Nanofluids with different nanoparticle-base fluid combinations and different nanoparticle volumetric fractions were calibrated. A microchannel heat sink (MCHS) liquid cooling test rig was used to investigate the thermal performance improvement of nanofluid-cooled liquid cooling systems. The thermal performance of the MCHS cooling system was measured and calculated in terms of junction-to-inlet and heatsink base-to-inlet thermal resistances. Thermal resistances and pressure drop across the MCHS with different working fluids under different flowrates ranging from 0.1 L/min to 0.8 L/min were measured and compared. Moreover, numerical simulations were conducted to evaluate the convective heat transfer enhancement of nanofluids within and beyond the range of the current experiments.
URI: http://scholarbank.nus.edu.sg/handle/10635/16977
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