Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/16554
Title: NANO-PARTICLE REINFORCED SOLDERS FOR MICROELECTRONIC INTERCONNECT APPLICATIONS
Authors: KATTA MOHAN KUMAR
Keywords: nano-particles,lead-free solders,CTE,mechanical properties,microstructure,reliability
Issue Date: 2-Jan-2009
Source: KATTA MOHAN KUMAR (2009-01-02). NANO-PARTICLE REINFORCED SOLDERS FOR MICROELECTRONIC INTERCONNECT APPLICATIONS. ScholarBank@NUS Repository.
Abstract: Interconnect materials with enhanced mechanical, thermal properties are required to meet the fine pitch, high performance, low cost and better reliability challenges of electronic packaging industry.<br> The overall focus of this research work is on the development of nanocomposite Sn-Pb and Sn-Ag-Cu solders reinforced with various types of nano-particles, the characterization of their microstructural, physical and mechanical properties, and the establishment of their reliability in actual flip-chip applications. <br>The plastic flow properties of Sn-Pb, and Sn-Ag-Cu based composite solders under strain rates from 10-5s-1 to 10-1s-1 at three different temperatures are reported. Influence of aging treatment and strain rate on the deformation characteristics of Sn-Pb and Sn-Ag-Cu based composite solders were investigated. Novel nanocomposite solder paste with varying weight fractions of nano-copper/nickel/molybdenum was successfully synthesized. Reliability performance of nanocomposite solder paste bumps, in level 1 interconnect assemblies were evaluated by mounting 20mm x 20mm flip chip packages with the nanocomposite solder joints and carrying out temperature cycling tests.<br>
URI: http://scholarbank.nus.edu.sg/handle/10635/16554
Appears in Collections:Ph.D Theses (Open)

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