Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/16196
Title: Copper recorvery and spent etchant regeneration based on supported liquid membrane technology
Authors: YANG QIAN
Keywords: Supported Liquid Membrane; spent etchant regeneration; copper recovery; membrane contactor; mathematical model; stability
Issue Date: 3-Apr-2007
Source: YANG QIAN (2007-04-03). Copper recorvery and spent etchant regeneration based on supported liquid membrane technology. ScholarBank@NUS Repository.
Abstract: The objective of this PhD research work is to develop a novel and more efficient supported liquid membrane (SLM) based process to recover copper and regenerate spent ammoniacal etchant solution for electronic industry. A comprehensive study has been accomplished in this PhD work, which covers a state of review on the recent advances in SLM technology, the screening of proper carrier for Cu(II) extraction in SLM system, the fundamental kinetics and mechanism of Cu(II) transport through flat sheet as well as hollow fiber SLM. A successful lab-scale to pilot-scale spent etchant treatment process was accomplished. Composition of the regenerated etching solution and purity of CuSO4I?5H2O crystals formed in the strip phase are comparable or even better than their commercial analogues. Despite their promising properties, SLMs are not widely used in an industrial scale mainly due to their instability and short life-time. In this PhD study, a low cost and promising room-temperature chemical surface crosslinking is firstly developed to improve the stability of SLM with polyimide as the support matrix.
URI: http://scholarbank.nus.edu.sg/handle/10635/16196
Appears in Collections:Ph.D Theses (Open)

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