Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/16006
Title: Study of Nanoscale Ductile Mode Cutting of Silicon Using Molecular Dynamics Simulation
Authors: CAI MINBO
Keywords: ductile cutting, silicon, molecular dynamics simulation, tool cutting edge radius, undeformed chip thickness
Issue Date: 21-Jul-2008
Source: CAI MINBO (2008-07-21). Study of Nanoscale Ductile Mode Cutting of Silicon Using Molecular Dynamics Simulation. ScholarBank@NUS Repository.
Abstract: Although much work has been done on nano machining of silicon, the machining mechanism is not yet explained clearly. In this research, a realistic molecular dynamics (MD) model has been developed to study the ductile mode cutting of monocrystalline silicon. The results of MD simulations showed that there is a phase transformation in the chip formation zone, which results in plastic deformation of the work material. Based on results from MD simulation, an approximation for the tensile stress distribution was obtained. Using this tensile stress distribution and fracture mechanics, an upper bound of tool cutting edge radius for crack initiation has been found. Also, the crack initiation in the ductile-brittle mode transition as the undeformed chip thickness is increased from smaller to larger than the tool cutting edge radius has been studied using the MD method, from which, for the first time, a peak deformation zone in the chip formation zone has been found in the transition. Lastly, a new concept b dynamic hard particlesb was proposed to investigate the mechanism of diamond micro/nano groove wear formation in ductile mode cutting of monocrystalline silicon with a diamond tool.
URI: http://scholarbank.nus.edu.sg/handle/10635/16006
Appears in Collections:Ph.D Theses (Open)

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