Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/15573
Title: PCM-based hybrid thermal management of electronic components
Authors: RAVI KANDASAMY
Keywords: Thermal Managment, Electronics cooling, Phase Change Materials, Thermal Charaterization, Modelling and Simultion, Thermal Interface Materials
Issue Date: 26-Nov-2006
Source: RAVI KANDASAMY (2006-11-26). PCM-based hybrid thermal management of electronic components. ScholarBank@NUS Repository.
Abstract: The primary goal of thermal design in electronics cooling is to achieve effective heat removal to increase reliability and life of the components and systems. The initial phase of this project focused on cooling of a flip chip package without the use of phase change materials (PCM). A flip chip package numerical thermal model was developed and validated. Numerical modeling is performed with the commercial computational fluid dynamics (CFD) software FLOTHERM for non-PCM simulations and using FLUENT for the PCM studies. Relevant thermal performance data for flip chip packages were obtained to demonstrate the effects of thermal interface material, lid, heat sink and process variables. Excellent agreement was found between the numerical predictions and the measured data. In the second phase of this project, application of a novel PCM-based package for passive thermal control of electronic devices was investigated experimentally. Two experimental setups, a tall enclosure with uniform and/or discrete heat sources applied on the sides for PCM melting studies and another one with a PCM-filled heat sink setup for cooling of a plastic quad flat package were developed and tested. The PCM-based cooling technique is expected to be an attractive thermal management concept for transient applications. Effects of various parameters such as power input level, orientation of the package to gravity, melting and/or freezing times were studied via numerical simulations. Flow visualization experiments were also made to determine the PCM melting rates. Finally, a two dimensional numerical study was conducted to compare simulation results with experimental data.
URI: http://scholarbank.nus.edu.sg/handle/10635/15573
Appears in Collections:Master's Theses (Open)

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