Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/15347
Title: Atomistic simulations of the mechanical properties of nanocrystalline copper at room temperature
Authors: ZHENG CHEN
Keywords: Nanocrystalline, Molecular dynamics, Plastic deformation, Shear plane, Porosity, Copper
Issue Date: 1-Jun-2006
Source: ZHENG CHEN (2006-06-01). Atomistic simulations of the mechanical properties of nanocrystalline copper at room temperature. ScholarBank@NUS Repository.
Abstract: Molecular dynamics simulations are performed to study the mechanical behavior of high-angle and low-angle nanocrystalline copper with an average grain size in the range of 3.7-6.7nm and the porous nanocrystalline copper with an average grain size of 5.8 nm at room temperature. It is found that the grain boundary sliding is the main deformation mechanism in the high-angle samples while both dislocation motion and grain boundary activities play an important role in the plastic deformation for low-angle samples. The grain boundary activities in the low-angle samples are manifested by migration, breakup and dislocation gliding within grain boundaries. The orientation of the grains to the tensile direction strongly affects the mechanical behavior of the low-angle samples. For the porous sample, the cracklike voids do not propagate along grain boundaries. Voids assist the formation of shear planes in some situations.
URI: http://scholarbank.nus.edu.sg/handle/10635/15347
Appears in Collections:Master's Theses (Open)

Show full item record
Files in This Item:
File Description SizeFormatAccess SettingsVersion 
upload_ZC.pdf1.23 MBAdobe PDF

OPEN

NoneView/Download

Page view(s)

228
checked on Dec 11, 2017

Download(s)

202
checked on Dec 11, 2017

Google ScholarTM

Check


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.