Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/15222
Title: Analysis of column interconnects for wafer level packages
Authors: SUN WEI
Keywords: interconnect, fatigue, finite element analysis, submodeling, design of experiment, wafer level packaging
Issue Date: 21-Mar-2006
Citation: SUN WEI (2006-03-21). Analysis of column interconnects for wafer level packages. ScholarBank@NUS Repository.
Abstract: This thesis focuses on the solder joint thermo-mechanical reliability analysis of Copper column (CuC) interconnect for wafer level packages. First, a simulation-based design optimization process was established based on ABAQUS and Minitab. This process integrated finite element simulation, design of experiment and numerical optimization, generating a systematic and efficient method that can study the effects of various design parameters on system response. Secondly, two new advanced finite element simulation methodologies, based on modeling chip/substrate as shells and interconnects as beams, together with shell-to-solid coupling and submodeling techniques, were developed to address the modeling difficulty of CuC interconnect in large packages with ultra-fine pitch. A feasibility demonstration of the two methodologies was firstly given. After this, as a case study, shell-and-beam-submodeling approach was chosen for solder joint fatigue life prediction of three different CuC interconnects in 20mm by 20mm wafer level packages with 100A?m pitch.
URI: http://scholarbank.nus.edu.sg/handle/10635/15222
Appears in Collections:Master's Theses (Open)

Show full item record
Files in This Item:
File Description SizeFormatAccess SettingsVersion 
Master_Thesis.pdf2.68 MBAdobe PDF

OPEN

NoneView/Download

Page view(s)

235
checked on Dec 16, 2018

Download(s)

205
checked on Dec 16, 2018

Google ScholarTM

Check


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.