Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/15222
Title: Analysis of column interconnects for wafer level packages
Authors: SUN WEI
Keywords: interconnect, fatigue, finite element analysis, submodeling, design of experiment, wafer level packaging
Issue Date: 21-Mar-2006
Source: SUN WEI (2006-03-21). Analysis of column interconnects for wafer level packages. ScholarBank@NUS Repository.
Abstract: This thesis focuses on the solder joint thermo-mechanical reliability analysis of Copper column (CuC) interconnect for wafer level packages. First, a simulation-based design optimization process was established based on ABAQUS and Minitab. This process integrated finite element simulation, design of experiment and numerical optimization, generating a systematic and efficient method that can study the effects of various design parameters on system response. Secondly, two new advanced finite element simulation methodologies, based on modeling chip/substrate as shells and interconnects as beams, together with shell-to-solid coupling and submodeling techniques, were developed to address the modeling difficulty of CuC interconnect in large packages with ultra-fine pitch. A feasibility demonstration of the two methodologies was firstly given. After this, as a case study, shell-and-beam-submodeling approach was chosen for solder joint fatigue life prediction of three different CuC interconnects in 20mm by 20mm wafer level packages with 100A?m pitch.
URI: http://scholarbank.nus.edu.sg/handle/10635/15222
Appears in Collections:Master's Theses (Open)

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