Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/14853
Title: Development of a novel ELID technique for machining of silicon wafers
Authors: MOHAMMAD MAJHARUL ISLAM
Keywords: Single crystal silicon wafers, Fine super-abrasive wheel, IE assisted ELID, Grinding performance, ground silicon wafer surface quality, subsurface
Issue Date: 12-Jul-2005
Source: MOHAMMAD MAJHARUL ISLAM (2005-07-12). Development of a novel ELID technique for machining of silicon wafers. ScholarBank@NUS Repository.
Abstract: Electrolyte In-process Dressing (ELID) grinding process is necessary to dress fine super-abrasive wheels for effective machining single crystal silicon wafers. A wide variety of the experiments were conducted by varying electrical and grinding parameters in order to grasp the basic mechanism of the process and the consequent process performance. Experimental results obtained from this study showed that intermediate range of experimental parameters significantly improved the wheel surface condition and hence better grinding performance leading to improved ground wafer surface qualities. The non-uniformity of the dressed wheel surface, however, made a limitation for the ELID process in generating required ground surface qualities. A new and novel electrolysis system, Injection Electrode (IE) assisted ELID, was therefore developed and introduced in this study to overcome the problems associated with conventional ELID grinding process. This modified process dramatically improved the wheel surface condition and consequently better grinding performance for machining silicon wafers was achieved.
URI: http://scholarbank.nus.edu.sg/handle/10635/14853
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