Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/14831
Title: Temperature regulation and in-situ fault detection of wafer warpage
Authors: CHEN WEI
Keywords: Wafer warpage, Fault detection,Feedforward, Temperature control,Lithogrophy,Semiconductor manufacturing
Issue Date: 7-Jun-2005
Source: CHEN WEI (2005-06-07). Temperature regulation and in-situ fault detection of wafer warpage. ScholarBank@NUS Repository.
Abstract: Wafer warpage is common in microelectronics processing. Warped wafers can affect device performance, reliability and linewidth control in various processing steps. The author proposed in this thesis an in-situ fault detection technique for wafer warpage in lithography.Early detection will minimize cost and processing time. Based on first principle thermal modeling, it is able to detect warpage fault from available temperature measurements. In this thesis, the use of advanced process control resulted in very small temperature disturbance making it suitable for industrial implementation. More importantly, the sensitivity for detecting warpage is not compromised even though the temperature signal is small. Experimental results demonstrated the feasibility of the approach.
URI: http://scholarbank.nus.edu.sg/handle/10635/14831
Appears in Collections:Master's Theses (Open)

Show full item record
Files in This Item:
File Description SizeFormatAccess SettingsVersion 
Disertation.pdf702.25 kBAdobe PDF

OPEN

NoneView/Download

Page view(s)

200
checked on Dec 11, 2017

Download(s)

293
checked on Dec 11, 2017

Google ScholarTM

Check


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.