Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/14618
Title: Electronic speckle pattern interferometry of residual stress measurement using hole-indentation method
Authors: SIM CHEN NAM
Keywords: optical measurement, residual stress measurement, hole indentation, out-of-plane displacement, non-destructive testing, ESPI.
Issue Date: 21-Apr-2005
Source: SIM CHEN NAM (2005-04-21). Electronic speckle pattern interferometry of residual stress measurement using hole-indentation method. ScholarBank@NUS Repository.
Abstract: Residual stresses is measured using a new technique combining hole indentation with Electronic Speckle Pattern Interferometry (ESPI). The technique is superior to conventional methods such as the widely used rosette strain-gage hole drilling technique in the ease of experimental set up and the use of optics in strain measurement allows results to be displayed in real-time. The technique is fast, simple, less destructive and has great potential to be developed into a quality inspection tool in the production/field environment.
URI: http://scholarbank.nus.edu.sg/handle/10635/14618
Appears in Collections:Master's Theses (Open)

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Summary.pdf21.12 kBAdobe PDF

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Bibliography.pdf43.75 kBAdobe PDF

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Appendix.pdf307.28 kBAdobe PDF

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