Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/14344
Title: Effect of crystallographic orientation on wear of diamond tools in nanoscale ductile cutting of silicon
Authors: MOHAMMAD SHARIF UDDIN
Keywords: Single crystal diamond; Tool wear; Crystallographic orientation; Ductile cutting; Silicon; Diamond Tool
Issue Date: 21-Oct-2004
Source: MOHAMMAD SHARIF UDDIN (2004-10-21). Effect of crystallographic orientation on wear of diamond tools in nanoscale ductile cutting of silicon. ScholarBank@NUS Repository.
Abstract: Abstract In this study, wear characteristics of diamond tools and the effect of different diamond crystallographic orientations on machining performance are investigated during nanoscale ductile cutting of silicon. Experimental results show that in nanoscale ductile cutting of silicon, traditional gradual flank wear along the effective cutting edge of tools are predominant. The SEM and EDX analysis of tool wear zone indicates that mechanical abrasion, adhesion, and possible thermo-chemical effect are responsible for this kind of tool wear. It is found that diamond tools with {110} orientations as the flank faces show higher wear resistance or tool life compared to those with other orientations. However, the trend of wear resistance characteristics of these tools is close to that of tool with {100} orientation as the flank face. This result reveals that under some machining conditions, diamond tool with {110} as the flank face can exhibit similar wear resistance characteristics as that with {100} as the flank face. It is also found that diamond tool with {110} as the flank face, and that with {100} as the flank face show lower thrust force compared to those other orientations. In addition, the study shows that there is no significant variation in surface roughness parameters with respect to machining time and tool wear for all tested tools with different crystallographic orientations.
URI: http://scholarbank.nus.edu.sg/handle/10635/14344
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