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Title: Development and applications of hard microstamping
Authors: WU LEI
Keywords: microscale, micropatterning, hard microstamping, two-dimensional, three-dimensional, metal pattern
Issue Date: 8-Sep-2004
Citation: WU LEI (2004-09-08). Development and applications of hard microstamping. ScholarBank@NUS Repository.
Abstract: We have developed two low-cost, versatile micropattering methods for fabricating micron and deep sub-micron conformal metal patterns on planar and non-planar polymeric substrates. We refer to our methods collectively as a??hard microstampinga?? since both of them use a pre-patterned rigid silicon stamp to emboss a polymeric substrate while selectively transferring substances, such as nanopaticles or thin metal films, to a substrate.We investigate their ability to generate to high-quality micron and deep sub-micron metal patterns in systems presenting problems in materials, topology, surface functionality that cannot easily be solved by photolithography. Scientific issues unique to the use of rigid stamps arise. Our work also involves optimizing the techniques, examining and explaining the principles, processes, and limitations. Our a??hard microstampinga?? techniques have potential applications in fields as diverse as semiconductor packaging and bioengineering. One such application is briefly examined.
Appears in Collections:Master's Theses (Open)

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