Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/136799
Title: IMPACT OF FERROMAGNETIC IRON MICRO-SEED IN SAC305 SOLDER AND SOLDER JOINT FORMATION FOR MICROELECTRONIC PACKAGING
Authors: ARUN KUMAR SESURAJ
Keywords: SAC (SnAgCu)
Issue Date: 13-Apr-2017
Citation: ARUN KUMAR SESURAJ (2017-04-13). IMPACT OF FERROMAGNETIC IRON MICRO-SEED IN SAC305 SOLDER AND SOLDER JOINT FORMATION FOR MICROELECTRONIC PACKAGING. ScholarBank@NUS Repository.
URI: http://scholarbank.nus.edu.sg/handle/10635/136799
Appears in Collections:Master's Theses (Closed)

Show full item record
Files in This Item:
There are no files associated with this item.

Page view(s)

38
checked on Feb 7, 2019

Google ScholarTM

Check


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.