Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/13618
Title: Modelling fatigue life of solder joints in wafer level packages
Authors: CHNG CHIA-K'AI, AUDREY
Keywords: Finite element method, macro-micro modelling, eutectic lead-tin solder, fatigue, wafer level packaging, interconnect
Issue Date: 20-Jan-2004
Source: CHNG CHIA-K'AI, AUDREY (2004-01-20). Modelling fatigue life of solder joints in wafer level packages. ScholarBank@NUS Repository.
Abstract: Wafer level packaging, in combination with the use of nano-structured materials (Nano WLP), is being explored as a technology to produce bigger electronic packages with smaller feature size. However, bigger packages also tend to have poorer thermo-mechanical reliability. ABAQUS, a commercial finite element analysis software, is used to analyse such packages to estimate the fatigue life of interconnects.A modified macro-micro model adapted from existing methodology is used to analyse these large packages (20mm by 20mm) with high interconnect density (100I?m pitch). The macro-micro modelling approach adopted is described in some detail, and the limitations and advantages discussed.The fatigue lives of two different interconnection technologies a?? Bed of Nails (BON) and Stretched Solder (SS) Column a?? are estimated and compared. The substrate coefficient of thermal expansion has a large influence on fatigue life, while BON orientation, SS height, and chip thickness have a moderate influence. Also, compliant interconnects are found to generally have longer fatigue lives.
URI: http://scholarbank.nus.edu.sg/handle/10635/13618
Appears in Collections:Master's Theses (Open)

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