Please use this identifier to cite or link to this item: https://doi.org/10.1109/APMC.2005.1606428
Title: Finite-ground thin-film microstrip interconnects (TFMIs) and their power handling capabilities over ultra-wide frequency ranges
Authors: Yin, W.-Y.
Dong, X.T. 
Mao, J.
Issue Date: 2005
Citation: Yin, W.-Y.,Dong, X.T.,Mao, J. (2005). Finite-ground thin-film microstrip interconnects (TFMIs) and their power handling capabilities over ultra-wide frequency ranges. Asia-Pacific Microwave Conference Proceedings, APMC 2 : -. ScholarBank@NUS Repository. https://doi.org/10.1109/APMC.2005.1606428
Abstract: Various finite-ground thin-film microstrip interconnects (TFMIs) used in the design of high-speed circuit, monolithic microwave and millimeter-wave integrated circuits are studied and compared. Based on the distributed parameters extracted and the thermal model proposed to calculate the rise in temperature, the average power handling capabilities (APHCs) of finite-ground TFMIs on Benzocyclobutene (BCB), polyimide and LTCC films over ultra-wide frequency ranges are investigated. Numerical results are given to show the enhancement in APHCs achieved by choosing appropriate metallization conductivity and thickness, BCB thermal conductivity, and polyimide thickness etc. © 2005 IEEE.
Source Title: Asia-Pacific Microwave Conference Proceedings, APMC
URI: http://scholarbank.nus.edu.sg/handle/10635/116080
ISBN: 078039433X
DOI: 10.1109/APMC.2005.1606428
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.

Page view(s)

27
checked on Nov 9, 2018

Google ScholarTM

Check

Altmetric


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.