Please use this identifier to cite or link to this item: https://doi.org/10.1109/TEPM.2005.857676
Title: Chemothermal modeling and finite-element analysis for microwave cure process of underfill in flip-chip packaging
Authors: Liu, L. 
Yi, S.
Ong, L.S.
Chian, K.S.
Osiyemi, S.
Lim, S.H.
Su, F.
Keywords: Electromagnetic heating
Finite-element methods
Flip-chip devices
Modeling
Packaging
Issue Date: Oct-2005
Citation: Liu, L., Yi, S., Ong, L.S., Chian, K.S., Osiyemi, S., Lim, S.H., Su, F. (2005-10). Chemothermal modeling and finite-element analysis for microwave cure process of underfill in flip-chip packaging. IEEE Transactions on Electronics Packaging Manufacturing 28 (4) : 355-363. ScholarBank@NUS Repository. https://doi.org/10.1109/TEPM.2005.857676
Abstract: The reaction kinetics of microwave cure process of underfill materials in flip-chip packaging was investigated with non-isothermal kinetic method and compared with that of the thermal cure. Three-dimensional (3-D) nonlinear cure kinetic and transient heat transfer coupled model was solved by finite-element method (FEM) to simulate the microwave cure process. The accuracy of the program was verified using a simple heat conduction case by commercial FEM software. Temperature and conversion inside underfill during microwave cure process were evaluated by solving the nonlinear anisotropic heat conduction equation including internal heat generation produced by exothermic chemical reactions. Numerical results show that the iteration calculations are very sensitive to small changes in time step sizes. It was also found that variable frequency microwave can process underfili materials with uniform conversion under different curing temperatures. © 2005 IEEE.
Source Title: IEEE Transactions on Electronics Packaging Manufacturing
URI: http://scholarbank.nus.edu.sg/handle/10635/115640
ISSN: 1521334X
DOI: 10.1109/TEPM.2005.857676
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.

SCOPUSTM   
Citations

7
checked on Nov 16, 2018

WEB OF SCIENCETM
Citations

3
checked on Dec 13, 2017

Page view(s)

28
checked on Nov 16, 2018

Google ScholarTM

Check

Altmetric


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.