Please use this identifier to cite or link to this item:
|Title:||Evaluation of residual stress in flip chip using 3-D optical interferometry/FEM hybrid technique|
|Citation:||Su, F., Liu, L., Wang, T. (2007-11). Evaluation of residual stress in flip chip using 3-D optical interferometry/FEM hybrid technique. Strain 43 (4) : 289-298. ScholarBank@NUS Repository. https://doi.org/10.1111/j.1475-1305.2007.00355.x|
|Abstract:||The residual stress in flip chips was investigated by a hybrid technique of 3-D finite element method (FEM) and 3-D optical interferometry. The residual stress consists of two parts: the chemical shrinkage stress caused by underfill curing and the thermal stress caused by coefficient of thermal expansion (CTE) mismatch and cooling. Warpage and in-plane deformation of the flip chip during the underfill curing and cooling procedure was real-time characterised with an integrated 3-D optical interferometry system. The measurement results were used to evaluate the chemical shrinkage stress and to verify/modify the FEM model for the analysis of thermal stress. It was found that the chemical shrinkage stress under isothermal curing condition is very small in average and negligible. As the difference between the simulated and measured thermal deformation falls within a limited scope, the accuracy of the simulated thermal stress can be guaranteed. © 2007 The Authors. Journal compilation 2007 Blackwell Publishing Ltd.|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Jun 15, 2018
WEB OF SCIENCETM
checked on May 21, 2018
checked on Jun 8, 2018
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.