Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.actamat.2004.07.018
Title: Molecular dynamics simulations of the preparation and deformation of nanocrystalline copper
Authors: Zhang, Y.W. 
Liu, P.
Lu, C.
Keywords: Copper
Molecular dynamics
Nanocrystalline materials
Nanoparticles consolidation
Plastic deformation
Issue Date: 4-Oct-2004
Citation: Zhang, Y.W., Liu, P., Lu, C. (2004-10-04). Molecular dynamics simulations of the preparation and deformation of nanocrystalline copper. Acta Materialia 52 (17) : 5105-5114. ScholarBank@NUS Repository. https://doi.org/10.1016/j.actamat.2004.07.018
Abstract: The molecular dynamics method is used here to simulate: (1) the preparation of full-density nanostructured copper by compacting copper nanoparticles and (2) the deformation behaviors of the nanostructured copper under compression. It is found that the packing arrangement, the size of the nanoparticles and the compaction temperature, affect the deformation behaviors of the nanostructured copper. Our simulation results also show that the synergy of the rotation and mass shedding of grains and the thickening and sliding of grain boundaries, prevents the formation of voids and cracks in the nanostructured copper under compression. © 2004 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
Source Title: Acta Materialia
URI: http://scholarbank.nus.edu.sg/handle/10635/107129
ISSN: 13596454
DOI: 10.1016/j.actamat.2004.07.018
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