Please use this identifier to cite or link to this item:
|Title:||Interface delamination generated by indentation in thin film systems - A computational mechanics study|
|Authors:||Zhang, Y.W. |
|Keywords:||Finite element method|
|Citation:||Zhang, Y.W., Zeng, K.Y., Thampurun, R. (2001-12). Interface delamination generated by indentation in thin film systems - A computational mechanics study. Materials Science and Engineering A 319-321 : 893-897. ScholarBank@NUS Repository. https://doi.org/10.1016/S0921-5093(01)01026-7|
|Abstract:||A finite element method is used to study the onset and propagation of delamination of interfaces in thin film systems during indentation by using a micro-wedge indenter. In the formulation, the interface adjoining the thin film and substrate is assumed to be the only site where cracking may occur. Both the thin film and the substrate are taken to be ductile materials with finite deformation. A traction-separation law, with two major parameters: Interface strength and interface energy, is introduced to simulate the adhesive and failure behaviors of the interface between the film and the substrate. The effects of the interface adhesive properties and the thickness of the thin film for cases of a hard film on a soft substrate and a soft film on a hard substrate on the onset and growth of interface delamination are investigated. © 2001 Elsevier Science B.V. All rights reserved.|
|Source Title:||Materials Science and Engineering A|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on May 14, 2018
WEB OF SCIENCETM
checked on May 7, 2018
checked on May 18, 2018
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.