Please use this identifier to cite or link to this item: https://doi.org/10.1007/BF02657724
Title: Correlation between intermetallic thickness and roughness during solder reflow
Authors: Zuruzi, A.S.
Lahiri, S.K.
Burman, P. 
Siow, K.S.
Keywords: Intermetallic
roughness
solders
Issue Date: Aug-2001
Citation: Zuruzi, A.S., Lahiri, S.K., Burman, P., Siow, K.S. (2001-08). Correlation between intermetallic thickness and roughness during solder reflow. Journal of Electronic Materials 30 (8) : 997-1000. ScholarBank@NUS Repository. https://doi.org/10.1007/BF02657724
Abstract: The evolution of Cu-Sn and Ni-Sn intermetallic compound (IM) morphologies during isochronal reflow of a PbSn solder with Cu and electroless-Ni was investigated. The root mean square roughness of the Cu-Sn and Ni-Sn IM layers exhibited a linear dependence on average thickness, with gradients () of 0.33 and 0.65, respectively. The difference in values was attributed to different thickness distributions resulting from morphological dissimilarity of the IM layers. The apparent activation energies for growth and roughness evolution of both IM were found to be similar and suggest that both IM thickness and roughness evolution are controlled by the same mechanism. © 2001 TMS-The Minerals, Metals and Materials Society.
Source Title: Journal of Electronic Materials
URI: http://scholarbank.nus.edu.sg/handle/10635/105075
ISSN: 03615235
DOI: 10.1007/BF02657724
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