Browsing by Title

Select a letter below to start browsing or type
0-9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z


Showing results 103960 to 103979 of 105730 < previous   next >
Issue DateTitleAuthor(s)
2007W18 - PDMST '07 & GRep '07: 4th international workshop on P2P Data Management, Security, and Trust: 3rd international workshop on Data management in Global data RepositoriesMadria, S.K.; Mondal, A.; Mohania, M.K.; Bhargava, B.; Bressan, S. ; Iwaihara, M.; Hameurlain, A.; Hara, T.; Lilien, L.; Gupta, S.K.; Bhowmick, S.S.; Chatvichienchai, S.; Bin, C.; Bellatreche, L.; Ibrahim, I.K.; Saito, K.; Cong, G.; Shen, J.; Dutta, D.; Garg, P.; Boncz, P.; Duma, C.; Kacimi, M.; Le, G.; Lee, Y.; Mani, M.; Palomar, E.; Pitoura, E.; Tan, K.-L. ; Tomarchio, O.; Trajcevski, G.; Di Vimercati, S.D.C.; Yolum, P.
2007W18 - PDMST '07 &amp; GRep '07: 4th international workshop on P2P Data Management, Security, and Trust: 3rd international workshop on Data management in Global data RepositoriesMadria, S.K.; Mondal, A.; Mohania, M.K.; Bhargava, B.; Bressan, S. ; Iwaihara, M.; Hameurlain, A.; Hara, T.; Lilien, L.; Gupta, S.K.; Bhowmick, S.S.; Chatvichienchai, S.; Bin, C.; Bellatreche, L.; Ibrahim, I.K.; Saito, K.; Cong, G.; Shen, J.; Dutta, D.; Garg, P.; Boncz, P.; Duma, C.; Kacimi, M.; Le, G.; Lee, Y.; Mani, M.; Palomar, E.; Pitoura, E.; Tan, K.-L. ; Tomarchio, O.; Trajcevski, G.; Di Vimercati, S.D.C.; Yolum, P.
2010W2Go: A travel guidance system by automatic landmark rankingGao, Y.; Tang, J. ; Hong, R. ; Dai, Q.; Chua, T.-S. ; Jain, R.
2014W3-privacy: Understanding what, when, and where inference channels in multi-camera surveillance videoSaini, M.; Atrey, P.K.; Mehrotra, S.; Kankanhalli, M. 
2014WADE: Simplified GUI add-on development for third-party softwareMeng, X.; Zhao, S. ; Huang, Y.; Zhang, Z.; Eagan, J.R.; Subramanian, R.
9-Mar-2005WAFER LEVEL ELECTROLESS COPPER METALLIZATION AND BUMPING PROCESS, AND PLATING SOLUTIONS FOR SEMICONDUCTOR WAFER AND MICROCHIPLU, HAIJING; GONG, HAO ; WONG, CHEE KHUEN STEPHEN
27-Nov-2003WAFER LEVEL ELECTROLESS COPPER METALLIZATION AND BUMPING PROCESS, AND PLATING SOLUTIONS FOR SEMICONDUCTOR WAFER AND MICROCHIPLU, HAIJING; GONG, HAO ; WONG, CHEE KHUEN STEPHEN
2008Wafer level hermetic bonding using Sn/In and Cu/Ti/Au metallizationYu, D.; Yan, L.; Lee, C. ; Choi, W.K.; Thew, M.L.; Foo, C.K.; Lau, J.H.
2005Wafer level packaging of pressure sensor using SU8 photoresistIliescu, C.; Tay, F.E.H. ; Miao, J.; Avram, M.
2013Wafer level silicon mould fabrication and imprinting of high density microstructuresWong, T.I.; Ong, H.Y.; Lu, H.J.; Tse, M.S.; Quan, C.G. ; Ng, S.H.; Zhou, X.
10-May-2005Wafer level super stretch solderWONG, EE HUA ; RAJOO, RANJAN; TEO, POI SIONG 
Aug-2004Wafer location integrity in aluminum metallizationNg, T.W. ; Lau, S.H.
2-Apr-1998Wafer packing for full mask exposure fabricationDu, D.; Lim, A. ; Wu, C.-T.
9-Sep-2004Wafer warpage detection during bake process in photolithographyYANG KAI
Apr-2009Wafer-level BCB bonding using a thermal press for microfluidicsZhou, X.; Virasawmy, S. ; Quan, C. 
Dec-2009Wafer-level hermetic bonding using Sn/In and Cu/Ti/Au metallizationYu, D.-Q.; Yan, L.L.; Lee, C. ; Choi, W.K.; Thew, S.; Foo, C.K.; Lau, J.H.
1-Jun-2005Wafer-level ordered arrays of aligned carbon nanotubes with controlled size and spacing on siliconKrishnan, R.; Nguyen, H.Q.; Thompson, C.V.; Choi, W.K. ; Foo, Y.L.
2010Wafer-level vacuum sealing and encapsulation for fabrication of CMOS MEMS thermoelectric power generatorsXie, J.; Lee, C. ; Wang, M.-F.; Feng, H.
Jan-2011Wafer-scale graphene/ferroelectric hybrid devices for low-voltage electronicsZheng, Y. ; Ni, G.-X.; Bae, S.; Cong, C.-X.; Kahya, O.; Toh, C.-T. ; Kim, H.R.; Im, D.; Yu, T.; Ahn, J.H.; Hong, B.H.; Özyilmaz, B. 
2012Wafer-scale, highly-ordered silicon nanowires produced by step-and-flash imprint lithography and metal-assisted chemical etchingHo, J.-W.; Wee, Q.; Dumond, J.; Zhang, L.; Zang, K.; Choi, W.K. ; Tay, A.A.O. ; Chua, S.-J.