Showing results 110503 to 110522 of 112461
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| Issue Date | Title | Author(s) |
| 2007 | W18 - PDMST '07 & GRep '07: 4th international workshop on P2P Data Management, Security, and Trust: 3rd international workshop on Data management in Global data Repositories | Madria, S.K.; Mondal, A.; Mohania, M.K.; Bhargava, B.; Bressan, S. ; Iwaihara, M.; Hameurlain, A.; Hara, T.; Lilien, L.; Gupta, S.K.; Bhowmick, S.S.; Chatvichienchai, S.; Bin, C.; Bellatreche, L.; Ibrahim, I.K.; Saito, K.; Cong, G.; Shen, J.; Dutta, D.; Garg, P.; Boncz, P.; Duma, C.; Kacimi, M.; Le, G.; Lee, Y.; Mani, M.; Palomar, E.; Pitoura, E.; Tan, K.-L. ; Tomarchio, O.; Trajcevski, G.; Di Vimercati, S.D.C.; Yolum, P. |
| 2007 | W18 - PDMST '07 & GRep '07: 4th international workshop on P2P Data Management, Security, and Trust: 3rd international workshop on Data management in Global data Repositories | Madria, S.K.; Mondal, A.; Mohania, M.K.; Bhargava, B.; Bressan, S. ; Iwaihara, M.; Hameurlain, A.; Hara, T.; Lilien, L.; Gupta, S.K.; Bhowmick, S.S.; Chatvichienchai, S.; Bin, C.; Bellatreche, L.; Ibrahim, I.K.; Saito, K.; Cong, G.; Shen, J.; Dutta, D.; Garg, P.; Boncz, P.; Duma, C.; Kacimi, M.; Le, G.; Lee, Y.; Mani, M.; Palomar, E.; Pitoura, E.; Tan, K.-L. ; Tomarchio, O.; Trajcevski, G.; Di Vimercati, S.D.C.; Yolum, P. |
| 2010 | W2Go: A travel guidance system by automatic landmark ranking | Gao, Y.; Tang, J. ; Hong, R. ; Dai, Q.; Chua, T.-S. ; Jain, R. |
| 2014 | W3-privacy: Understanding what, when, and where inference channels in multi-camera surveillance video | Saini, M.; Atrey, P.K.; Mehrotra, S.; Kankanhalli, M. |
| 2014 | WADE: Simplified GUI add-on development for third-party software | Meng, X.; Zhao, S. ; Huang, Y.; Zhang, Z.; Eagan, J.R.; Subramanian, R. |
| 9-Mar-2005 | WAFER LEVEL ELECTROLESS COPPER METALLIZATION AND BUMPING PROCESS, AND PLATING SOLUTIONS FOR SEMICONDUCTOR WAFER AND MICROCHIP | LU, HAIJING; GONG, HAO ; WONG, CHEE KHUEN STEPHEN |
| 27-Nov-2003 | WAFER LEVEL ELECTROLESS COPPER METALLIZATION AND BUMPING PROCESS, AND PLATING SOLUTIONS FOR SEMICONDUCTOR WAFER AND MICROCHIP | LU, HAIJING; GONG, HAO ; WONG, CHEE KHUEN STEPHEN |
| 2008 | Wafer level hermetic bonding using Sn/In and Cu/Ti/Au metallization | Yu, D.; Yan, L.; Lee, C. ; Choi, W.K.; Thew, M.L.; Foo, C.K.; Lau, J.H. |
| 2005 | Wafer level packaging of pressure sensor using SU8 photoresist | Iliescu, C.; Tay, F.E.H. ; Miao, J.; Avram, M. |
| 2013 | Wafer level silicon mould fabrication and imprinting of high density microstructures | Wong, T.I.; Ong, H.Y.; Lu, H.J.; Tse, M.S.; Quan, C.G. ; Ng, S.H.; Zhou, X. |
| 10-May-2005 | Wafer level super stretch solder | WONG, EE HUA ; RAJOO, RANJAN; TEO, POI SIONG |
| Aug-2004 | Wafer location integrity in aluminum metallization | Ng, T.W. ; Lau, S.H. |
| 2-Apr-1998 | Wafer packing for full mask exposure fabrication | Du, D.; Lim, A. ; Wu, C.-T. |
| 9-Sep-2004 | Wafer warpage detection during bake process in photolithography | YANG KAI |
| Apr-2009 | Wafer-level BCB bonding using a thermal press for microfluidics | Zhou, X.; Virasawmy, S. ; Quan, C. |
| Dec-2009 | Wafer-level hermetic bonding using Sn/In and Cu/Ti/Au metallization | Yu, D.-Q.; Yan, L.L.; Lee, C. ; Choi, W.K.; Thew, S.; Foo, C.K.; Lau, J.H. |
| 1-Jun-2005 | Wafer-level ordered arrays of aligned carbon nanotubes with controlled size and spacing on silicon | Krishnan, R.; Nguyen, H.Q.; Thompson, C.V.; Choi, W.K. ; Foo, Y.L. |
| 2010 | Wafer-level vacuum sealing and encapsulation for fabrication of CMOS MEMS thermoelectric power generators | Xie, J.; Lee, C. ; Wang, M.-F.; Feng, H. |
| Jan-2011 | Wafer-scale graphene/ferroelectric hybrid devices for low-voltage electronics | Zheng, Y. ; Ni, G.-X.; Bae, S.; Cong, C.-X.; Kahya, O.; Toh, C.-T. ; Kim, H.R.; Im, D.; Yu, T.; Ahn, J.H.; Hong, B.H.; Özyilmaz, B. |
| 2012 | Wafer-scale, highly-ordered silicon nanowires produced by step-and-flash imprint lithography and metal-assisted chemical etching | Ho, J.-W.; Wee, Q.; Dumond, J.; Zhang, L.; Zang, K.; Choi, W.K. ; Tay, A.A.O. ; Chua, S.-J. |
